Filtered by vendor Qualcomm
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Filtered by product Msm8909w
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Total
641 CVE
CVE | Vendors | Products | Updated | CVSS v3.1 |
---|---|---|---|---|
CVE-2017-18279 | 1 Qualcomm | 78 Fsm9055, Fsm9055 Firmware, Fsm9955 and 75 more | 2024-11-21 | 7.8 High |
Lack of check of buffer length before copying can lead to buffer overflow in camera module in Small Cell SoC, Snapdragon Mobile, Snapdragon Wear in FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, QCA9558, QCA9563, QCA9880, QCA9886, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016. | ||||
CVE-2017-18277 | 1 Qualcomm | 46 Mdm9206, Mdm9206 Firmware, Mdm9607 and 43 more | 2024-11-21 | N/A |
When dynamic memory allocation fails, currently the process sleeps for one second and continues with infinite loop without retrying for memory allocation in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, QCN5502, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 600, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835. | ||||
CVE-2017-18275 | 1 Qualcomm | 42 Mdm9206, Mdm9206 Firmware, Mdm9607 and 39 more | 2024-11-21 | N/A |
A new account can be inserted into simContacts service using Android command line tool in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845. | ||||
CVE-2017-18160 | 1 Qualcomm | 16 Mdm9635m, Mdm9635m Firmware, Mdm9645 and 13 more | 2024-11-21 | N/A |
AGPS session failure in GNSS module due to cyphersuites are hardcoded and needed manual update everytime in snapdragon mobile and snapdragon wear in versions MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 835, SD 845, SD 850 | ||||
CVE-2017-18157 | 1 Qualcomm | 42 Mdm9206, Mdm9206 Firmware, Mdm9607 and 39 more | 2024-11-21 | N/A |
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20. | ||||
CVE-2017-18146 | 1 Qualcomm | 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more | 2024-11-21 | N/A |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, in some corner cases, ECDSA signature verification can fail. | ||||
CVE-2017-18145 | 1 Qualcomm | 28 Msm8909w, Msm8909w Firmware, Sd 205 and 25 more | 2024-11-21 | N/A |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while the DPM native process is processing framework events, the iterator pointer is deleted after processing an event. When processing subsequent events, a Use After Condition will occur. | ||||
CVE-2017-18144 | 1 Qualcomm | 28 Msm8909w, Msm8909w Firmware, Sd 205 and 25 more | 2024-11-21 | N/A |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while processing the retransmission of WPA supplicant command send failures, there is a make after break of the connection to WPA supplicant where the local pointer is not properly updated. If the WPA supplicant command transmission fails, a Use After Free condition will occur. | ||||
CVE-2017-18140 | 1 Qualcomm | 48 Mdm9206, Mdm9206 Firmware, Mdm9607 and 45 more | 2024-11-21 | N/A |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. If eMBMS service is enabled while processing the call disconnect, a Use After Free condition may potentially occur. | ||||
CVE-2017-18139 | 1 Qualcomm | 60 Mdm9206, Mdm9206 Firmware, Mdm9607 and 57 more | 2024-11-21 | N/A |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, a buffer overflow vulnerability may potentially exist while making an IMS call. | ||||
CVE-2017-18138 | 1 Qualcomm | 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more | 2024-11-21 | N/A |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, in GERAN, a buffer overflow may potentially occur. | ||||
CVE-2017-18136 | 1 Qualcomm | 52 Mdm9206, Mdm9206 Firmware, Mdm9607 and 49 more | 2024-11-21 | N/A |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 820, SD 820A, SD 835, SD 845, in the omx aac component, a Use After Free condition may potentially occur. | ||||
CVE-2017-18127 | 1 Qualcomm | 24 Msm8909w, Msm8909w Firmware, Sd 205 and 21 more | 2024-11-21 | N/A |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 835, SD 845, while processing a SetParam command packet in the VR service, the extracted name_len and value_len values are not checked and could potentially cause a buffer overflow in subsequent calls to memcpy(). | ||||
CVE-2017-18124 | 1 Qualcomm | 72 Fsm9055, Fsm9055 Firmware, Ipq4019 and 69 more | 2024-11-21 | N/A |
During secure boot, addition is performed on uint8 ptrs which led to overflow issue in Small Cell SoC, Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version FSM9055, IPQ4019, MDM9206, MDM9607, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDX20 | ||||
CVE-2017-18074 | 1 Qualcomm | 46 Mdm9607, Mdm9607 Firmware, Mdm9625 and 43 more | 2024-11-21 | N/A |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9607, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 615/16/SD 415, SD 800, SD 808, SD 810, SD 820, SD 835, while playing a .wma file with modified media header with non-standard bytes per second parameter value, a reachable assert occurs. | ||||
CVE-2017-18071 | 1 Qualcomm | 24 Mdm9206, Mdm9206 Firmware, Mdm9607 and 21 more | 2024-11-21 | N/A |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, debug policy can potentially be bypassed. | ||||
CVE-2017-17773 | 1 Qualcomm | 58 Mdm9206, Mdm9206 Firmware, Mdm9607 and 55 more | 2024-11-21 | N/A |
In Snapdragon Automobile, Snapdragon Wearable and Snapdragon Mobile MDM9206,MDM9607,MDM9650,SD 210/SD 212/SD 205,SD 400,SD 410/12,SD 425,SD 430,SD 450,SD 600,SD 602A,SD 615/16/SD 415,SD 617,SD 625,SD 650/52,SD 800,SD 808,SD 810,SD 820,SD 820Am,SD 835,SD 845,MSM8909W, improper input validation in video_fmt_mp4r_process_atom_avc1() causes a potential buffer overflow. | ||||
CVE-2017-14912 | 1 Qualcomm | 42 Mdm9206, Mdm9206 Firmware, Mdm9607 and 39 more | 2024-11-21 | N/A |
In Android before 2018-01-05 on Qualcomm Snapdragon IoT, Snapdragon Mobile [VERSION]: MDM9206, MDM9607, MDM9650, MSM8909W, SD 200, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 835, the attributes of buffers in Secure Display were not marked properly. | ||||
CVE-2017-11088 | 1 Qualcomm | 28 Msm8909w, Msm8909w Firmware, Msm8996au and 25 more | 2024-11-21 | N/A |
Improper Input Validation in Linux io-prefetch in Snapdragon Mobile and Snapdragon Wear, A SQL injection vulnerability exists in versions MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 835, SD 845. | ||||
CVE-2016-10501 | 1 Qualcomm | 52 Fsm9055, Fsm9055 Firmware, Mdm9206 and 49 more | 2024-11-21 | N/A |
In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile, Snapdragon Wear, and Small Cell SoC FSM9055, MDM9206, MDM9607, MDM9635M, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, and SD 835, improper input validation can occur while parsing an image. |